%0 Journal Article %1 journals/mr/LinLW08 %A Lin, M. H. %A Lin, M. T. %A Wang, Tahui %D 2008 %J Microelectron. Reliab. %K dblp %N 4 %P 569-577 %T Effects of length scaling on electromigration in dual-damascene copper interconnects. %U http://dblp.uni-trier.de/db/journals/mr/mr48.html#LinLW08 %V 48

@article{journals/mr/LinLW08, added-at = {2020-02-22T00:00:00.000+0100}, author = {Lin, M. H. and Lin, M. T. and Wang, Tahui}, biburl = {https://www.bibsonomy.org/bibtex/2d12e20155676d02d643e1e68b1152048/dblp}, ee = {https://doi.org/10.1016/j.microrel.2007.10.007}, interhash = {74953cc4fcb3f671cbc05c40eb882412}, intrahash = {d12e20155676d02d643e1e68b1152048}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 4, pages = {569-577}, timestamp = {2020-02-25T13:26:32.000+0100}, title = {Effects of length scaling on electromigration in dual-damascene copper interconnects.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr48.html#LinLW08}, volume = 48, year = 2008 }