%0 Conference Paper %1 conf/irps/LiangYSHJLP18 %A Liang, Xianhu %A Yuan, Bin %A Shi, Yuanyuan %A Hui, Fei %A Jing, Xu %A Lanza, Mario %A Palumbo, Felix %B IRPS %D 2018 %I IEEE %K dblp %P 6-1 %T Enhanced reliability of hexagonal boron nitride dielectric stacks due to high thermal conductivity. %U http://dblp.uni-trier.de/db/conf/irps/irps2018.html#LiangYSHJLP18 %@ 978-1-5386-5479-8

@inproceedings{conf/irps/LiangYSHJLP18, added-at = {2019-05-29T00:00:00.000+0200}, author = {Liang, Xianhu and Yuan, Bin and Shi, Yuanyuan and Hui, Fei and Jing, Xu and Lanza, Mario and Palumbo, Felix}, biburl = {https://www.bibsonomy.org/bibtex/2f69e054bcb9051432b66c3fb78d19229/dblp}, booktitle = {IRPS}, crossref = {conf/irps/2018}, ee = {https://doi.org/10.1109/IRPS.2018.8353666}, interhash = {79abfef0b321280167b1c4eeff3d994d}, intrahash = {f69e054bcb9051432b66c3fb78d19229}, isbn = {978-1-5386-5479-8}, keywords = {dblp}, pages = {6-1}, publisher = {IEEE}, timestamp = {2019-10-17T14:45:36.000+0200}, title = {Enhanced reliability of hexagonal boron nitride dielectric stacks due to high thermal conductivity.}, url = {http://dblp.uni-trier.de/db/conf/irps/irps2018.html#LiangYSHJLP18}, year = 2018 }