%0 Journal Article %1 journals/access/DongLJH21 %A Dong, Jiayan %A Long, Yingli %A Jiao, Xiaoxuan %A Huang, Yifeng %D 2021 %J IEEE Access %K dblp %P 117444-117455 %T Research on Wiener Degradation Model and Failure Mechanism of Interconnect Solder Joints Under Random Vibration Load. %U http://dblp.uni-trier.de/db/journals/access/access9.html#DongLJH21 %V 9

@article{journals/access/DongLJH21, added-at = {2021-09-01T00:00:00.000+0200}, author = {Dong, Jiayan and Long, Yingli and Jiao, Xiaoxuan and Huang, Yifeng}, biburl = {https://www.bibsonomy.org/bibtex/26794f2f2cd887cf9f1b6b55c4856e243/dblp}, ee = {https://doi.org/10.1109/ACCESS.2021.3106261}, interhash = {7da980284ab048c0cfc680507b300a79}, intrahash = {6794f2f2cd887cf9f1b6b55c4856e243}, journal = {IEEE Access}, keywords = {dblp}, pages = {117444-117455}, timestamp = {2024-04-08T14:07:09.000+0200}, title = {Research on Wiener Degradation Model and Failure Mechanism of Interconnect Solder Joints Under Random Vibration Load.}, url = {http://dblp.uni-trier.de/db/journals/access/access9.html#DongLJH21}, volume = 9, year = 2021 }