%0 Journal Article %1 journals/tie/ZhangDYZST19 %A Zhang, Jun %A Du, Xiong %A Yu, Yaoyi %A Zheng, Shuai %A Sun, Pengju %A Tai, Heng-Ming %D 2019 %J IEEE Trans. Ind. Electron. %K dblp %N 10 %P 8148-8160 %T Thermal Parameter Monitoring of IGBT Module Using Junction Temperature Cooling Curves. %U http://dblp.uni-trier.de/db/journals/tie/tie66.html#ZhangDYZST19 %V 66

@article{journals/tie/ZhangDYZST19, added-at = {2020-05-22T00:00:00.000+0200}, author = {Zhang, Jun and Du, Xiong and Yu, Yaoyi and Zheng, Shuai and Sun, Pengju and Tai, Heng-Ming}, biburl = {https://www.bibsonomy.org/bibtex/2ade5d35e549cdf7503f5df9ca6db53a7/dblp}, ee = {https://doi.org/10.1109/TIE.2018.2883258}, interhash = {84b2317317d428e02ad2af716e686c00}, intrahash = {ade5d35e549cdf7503f5df9ca6db53a7}, journal = {IEEE Trans. Ind. Electron.}, keywords = {dblp}, number = 10, pages = {8148-8160}, timestamp = {2020-05-23T11:43:24.000+0200}, title = {Thermal Parameter Monitoring of IGBT Module Using Junction Temperature Cooling Curves.}, url = {http://dblp.uni-trier.de/db/journals/tie/tie66.html#ZhangDYZST19}, volume = 66, year = 2019 }