%0 Journal Article %1 journals/tie/ZhangGHCCTY21 %A Zhang, Lanyu %A Gao, Jian %A He, Yunbo %A Chen, Xin %A Chen, Yun %A Tang, Hui %A Yang, Zhijun %D 2021 %J IEEE Trans. Ind. Electron. %K dblp %N 8 %P 7252-7262 %T A VCM Active Actuation Method for Bonding Time Reduction in Chip Packaging Process. %U http://dblp.uni-trier.de/db/journals/tie/tie68.html#ZhangGHCCTY21 %V 68

@article{journals/tie/ZhangGHCCTY21, added-at = {2023-09-30T00:00:00.000+0200}, author = {Zhang, Lanyu and Gao, Jian and He, Yunbo and Chen, Xin and Chen, Yun and Tang, Hui and Yang, Zhijun}, biburl = {https://www.bibsonomy.org/bibtex/2690d13ba9e2607871a372197a740cc70/dblp}, ee = {https://doi.org/10.1109/TIE.2020.3020018}, interhash = {857d95f239550628f4f2e66dba7a0f36}, intrahash = {690d13ba9e2607871a372197a740cc70}, journal = {IEEE Trans. Ind. Electron.}, keywords = {dblp}, number = 8, pages = {7252-7262}, timestamp = {2024-04-08T10:32:58.000+0200}, title = {A VCM Active Actuation Method for Bonding Time Reduction in Chip Packaging Process.}, url = {http://dblp.uni-trier.de/db/journals/tie/tie68.html#ZhangGHCCTY21}, volume = 68, year = 2021 }