Inproceedings,
Silicon-interposer with high density Cu-filled TSVs.
R. Wieland, K. Zoschke, N. Jurgensen, K. Merkel, L. Nebrich, and J. Wolf.3DIC, page 1-4. IEEE, (2010)
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- conf/3dic/WielandZJMNW10
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- inproceedings
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- 3DIC
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- 2010
- pages
- 1-4
- publisher
- IEEE
- crossref
- conf/3dic/2010
- ee
- https://doi.org/10.1109/3DIC.2010.5751469
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- 978-1-4577-0526-7
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- http://dblp.uni-trier.de/db/conf/3dic/3dic2010.html#WielandZJMNW10
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- please select -%0 Conference Paper
%1 conf/3dic/WielandZJMNW10
%A Wieland, Robert
%A Zoschke, Kai
%A Jurgensen, Nils
%A Merkel, Karl-Reinhard
%A Nebrich, Lars
%A Wolf, Jürgen
%B 3DIC
%D 2010
%I IEEE
%K dblp
%P 1-4
%T Silicon-interposer with high density Cu-filled TSVs.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2010.html#WielandZJMNW10
%@ 978-1-4577-0526-7
@inproceedings{conf/3dic/WielandZJMNW10,
added-at = {2023-09-30T00:00:00.000+0200},
author = {Wieland, Robert and Zoschke, Kai and Jurgensen, Nils and Merkel, Karl-Reinhard and Nebrich, Lars and Wolf, Jürgen},
biburl = {https://www.bibsonomy.org/bibtex/2dec552cff556ca58e9dc72b2bd12e07b/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2010},
ee = {https://doi.org/10.1109/3DIC.2010.5751469},
interhash = {87e622c331a4fe32a296e6fac5fc1ea3},
intrahash = {dec552cff556ca58e9dc72b2bd12e07b},
isbn = {978-1-4577-0526-7},
keywords = {dblp},
pages = {1-4},
publisher = {IEEE},
timestamp = {2024-04-10T12:11:20.000+0200},
title = {Silicon-interposer with high density Cu-filled TSVs.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2010.html#WielandZJMNW10},
year = 2010
}