%0 Journal Article %1 journals/mr/GuN04 %A Gu, Yu %A Nakamura, Toshio %D 2004 %J Microelectron. Reliab. %K dblp %N 3 %P 471-483 %T Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages. %U http://dblp.uni-trier.de/db/journals/mr/mr44.html#GuN04 %V 44

@article{journals/mr/GuN04, added-at = {2020-02-22T00:00:00.000+0100}, author = {Gu, Yu and Nakamura, Toshio}, biburl = {https://www.bibsonomy.org/bibtex/283ec369a921f88f271664b946c6e4009/dblp}, ee = {https://doi.org/10.1016/j.microrel.2003.11.002}, interhash = {8a39f35c2dcabc7fc757d5fc31c83944}, intrahash = {83ec369a921f88f271664b946c6e4009}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 3, pages = {471-483}, timestamp = {2020-02-25T13:29:17.000+0100}, title = {Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr44.html#GuN04}, volume = 44, year = 2004 }