%0 Conference Paper %1 conf/smc/Chiang03 %A Chiang, Chia-Chu %B SMC %D 2003 %I IEEE %K dblp %P 142-147 %T LIM: a layered interconnection model for improving component reuse. %U http://dblp.uni-trier.de/db/conf/smc/smc2003.html#Chiang03 %@ 0-7803-7952-7

@inproceedings{conf/smc/Chiang03, added-at = {2017-05-17T00:00:00.000+0200}, author = {Chiang, Chia-Chu}, biburl = {https://www.bibsonomy.org/bibtex/2d0c09e0964c45e5afebf9fce939d3bdd/dblp}, booktitle = {SMC}, crossref = {conf/smc/2003}, ee = {https://doi.org/10.1109/ICSMC.2003.1243805}, interhash = {98c8e37cb8bdc247d4ea08be9bdbf959}, intrahash = {d0c09e0964c45e5afebf9fce939d3bdd}, isbn = {0-7803-7952-7}, keywords = {dblp}, pages = {142-147}, publisher = {IEEE}, timestamp = {2019-10-17T22:35:39.000+0200}, title = {LIM: a layered interconnection model for improving component reuse.}, url = {http://dblp.uni-trier.de/db/conf/smc/smc2003.html#Chiang03}, year = 2003 }