%0 Conference Paper %1 conf/3dic/VianneFFCCLCPRE15 %A Vianne, Benjamin %A Farcy, Alexis %A Fiori, Vincent %A Chappaz, Cédrick %A Chevrier, Norbert %A Lobascio, G. %A Chausse, Pascal %A Ponthenier, F. %A Ruckly, A. %A Escoubas, Stephanie %A Thomas, Olivier %B 3DIC %D 2015 %I IEEE %K dblp %P TS11.4.1-TS11.4.7 %T Stress management strategy to limit die curvature during silicon interposer integration. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#VianneFFCCLCPRE15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/VianneFFCCLCPRE15, added-at = {2019-07-16T00:00:00.000+0200}, author = {Vianne, Benjamin and Farcy, Alexis and Fiori, Vincent and Chappaz, Cédrick and Chevrier, Norbert and Lobascio, G. and Chausse, Pascal and Ponthenier, F. and Ruckly, A. and Escoubas, Stephanie and Thomas, Olivier}, biburl = {https://www.bibsonomy.org/bibtex/22c39aa292dd5362aaff977a39fd6e132/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334622}, interhash = {991bde7057dfd3d329eaddf4d98ee2cd}, intrahash = {2c39aa292dd5362aaff977a39fd6e132}, isbn = {978-1-4673-9385-0}, keywords = {dblp}, pages = {TS11.4.1-TS11.4.7}, publisher = {IEEE}, timestamp = {2019-07-17T11:43:37.000+0200}, title = {Stress management strategy to limit die curvature during silicon interposer integration.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#VianneFFCCLCPRE15}, year = 2015 }