%0 Journal Article %1 journals/mr/OmiyaKSKCSNSNSN13 %A Omiya, Masaki %A Koiwa, Kozo %A Shishido, Nobuyuki %A Kamiya, Shoji %A Chen, Chuantong %A Sato, Hisashi %A Nishida, Masahiro %A Suzuki, Takashi %A Nakamura, Tomoji %A Suzuki, Toshiaki %A Nokuo, Takeshi %D 2013 %J Microelectron. Reliab. %K dblp %N 4 %P 612-621 %T Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures. %U http://dblp.uni-trier.de/db/journals/mr/mr53.html#OmiyaKSKCSNSNSN13 %V 53

@article{journals/mr/OmiyaKSKCSNSNSN13, added-at = {2021-10-14T00:00:00.000+0200}, author = {Omiya, Masaki and Koiwa, Kozo and Shishido, Nobuyuki and Kamiya, Shoji and Chen, Chuantong and Sato, Hisashi and Nishida, Masahiro and Suzuki, Takashi and Nakamura, Tomoji and Suzuki, Toshiaki and Nokuo, Takeshi}, biburl = {https://www.bibsonomy.org/bibtex/23f5d6b67f21f440ce0886b61fbcf4f90/dblp}, ee = {https://doi.org/10.1016/j.microrel.2012.12.009}, interhash = {9afb0eefe30364945adab190470f990e}, intrahash = {3f5d6b67f21f440ce0886b61fbcf4f90}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 4, pages = {612-621}, timestamp = {2024-04-09T02:49:37.000+0200}, title = {Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr53.html#OmiyaKSKCSNSNSN13}, volume = 53, year = 2013 }