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%0 Conference Paper
%1 conf/dese/MackowiakALEBNZ19
%A Mackowiak, Piotr
%A Al-Magazachi, Samer
%A Lang, Klaus-Dieter
%A Erbacher, Kolja
%A Bäuscher, Manuel
%A Ngo, Ha-Duong
%A Zoschke, Kai
%A Schiffer, Michael
%B DeSE
%D 2019
%I IEEE
%K dblp
%P 902-905
%T Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies.
%U http://dblp.uni-trier.de/db/conf/dese/dese2019.html#MackowiakALEBNZ19
%@ 978-1-7281-3021-7
@inproceedings{conf/dese/MackowiakALEBNZ19,
added-at = {2021-10-14T00:00:00.000+0200},
author = {Mackowiak, Piotr and Al-Magazachi, Samer and Lang, Klaus-Dieter and Erbacher, Kolja and Bäuscher, Manuel and Ngo, Ha-Duong and Zoschke, Kai and Schiffer, Michael},
biburl = {https://www.bibsonomy.org/bibtex/20f63aff0ad02ec1c9e845cadbdd5353a/dblp},
booktitle = {DeSE},
crossref = {conf/dese/2019},
ee = {https://doi.org/10.1109/DeSE.2019.00167},
interhash = {a5db9cc526326fb405c7af87bec0ce66},
intrahash = {0f63aff0ad02ec1c9e845cadbdd5353a},
isbn = {978-1-7281-3021-7},
keywords = {dblp},
pages = {902-905},
publisher = {IEEE},
timestamp = {2024-04-10T06:16:53.000+0200},
title = {Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies.},
url = {http://dblp.uni-trier.de/db/conf/dese/dese2019.html#MackowiakALEBNZ19},
year = 2019
}