%0 Conference Paper %1 conf/3dic/ZhangS11 %A Zhang, Chao %A Sun, Guangyu %B 3DIC %D 2011 %E Koyanagi, Mitsumasa %E Kada, Morihiro %I IEEE %K dblp %P 1-4 %T Fabrication cost analysis for 2D, 2.5D, and 3D IC designs. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#ZhangS11 %@ 978-1-4673-2189-1

@inproceedings{conf/3dic/ZhangS11, added-at = {2019-05-18T00:00:00.000+0200}, author = {Zhang, Chao and Sun, Guangyu}, biburl = {https://www.bibsonomy.org/bibtex/2aa943083eea9631706904cb15b21012e/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2011}, editor = {Koyanagi, Mitsumasa and Kada, Morihiro}, ee = {https://doi.org/10.1109/3DIC.2012.6263032}, interhash = {aeb13df053eaffbce458719dbde1d8fd}, intrahash = {aa943083eea9631706904cb15b21012e}, isbn = {978-1-4673-2189-1}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:14.000+0200}, title = {Fabrication cost analysis for 2D, 2.5D, and 3D IC designs.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#ZhangS11}, year = 2011 }