%0 Conference Paper %1 conf/3dic/SantosSCCCVBRJF14 %A Santos, Cristiano %A Souare, Papa Momar %A de Crecy, François %A Coudrain, Perceval %A Colonna, Jean-Philippe %A Vivet, Pascal %A Borbely, Andras %A Reis, Ricardo %A Jamaa, M. Haykel Ben %A Fiori, Vincent %A Farcy, Alexis %B 3DIC %D 2014 %I IEEE %K dblp %P 1-8 %T Using TSVs for thermal mitigation in 3D circuits: Wish and truth. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#SantosSCCCVBRJF14 %@ 978-1-4799-8472-5

@inproceedings{conf/3dic/SantosSCCCVBRJF14, added-at = {2021-01-21T00:00:00.000+0100}, author = {Santos, Cristiano and Souare, Papa Momar and de Crecy, François and Coudrain, Perceval and Colonna, Jean-Philippe and Vivet, Pascal and Borbely, Andras and Reis, Ricardo and Jamaa, M. Haykel Ben and Fiori, Vincent and Farcy, Alexis}, biburl = {https://www.bibsonomy.org/bibtex/27eebd87568648abffdfb64e475e0107d/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2014}, ee = {https://doi.org/10.1109/3DIC.2014.7152167}, interhash = {c10db1ab479cbf2547b554dd77629906}, intrahash = {7eebd87568648abffdfb64e475e0107d}, isbn = {978-1-4799-8472-5}, keywords = {dblp}, pages = {1-8}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:53.000+0200}, title = {Using TSVs for thermal mitigation in 3D circuits: Wish and truth.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#SantosSCCCVBRJF14}, year = 2014 }