%0 Journal Article %1 journals/pieee/ChristiansenSG06 %A Christiansen, Silke H. %A Singh, Rajendra %A Gosele, Ulrich %D 2006 %J Proc. IEEE %K dblp %N 12 %P 2060-2106 %T Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics. %U http://dblp.uni-trier.de/db/journals/pieee/pieee94.html#ChristiansenSG06 %V 94

@article{journals/pieee/ChristiansenSG06, added-at = {2020-10-02T00:00:00.000+0200}, author = {Christiansen, Silke H. and Singh, Rajendra and Gosele, Ulrich}, biburl = {https://www.bibsonomy.org/bibtex/285b5ea0622b06c3a1b37998430673333/dblp}, ee = {https://doi.org/10.1109/JPROC.2006.886026}, interhash = {c271b30af494eaae3e6e59c50fdb9ec1}, intrahash = {85b5ea0622b06c3a1b37998430673333}, journal = {Proc. IEEE}, keywords = {dblp}, number = 12, pages = {2060-2106}, timestamp = {2020-10-03T11:45:08.000+0200}, title = {Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics.}, url = {http://dblp.uni-trier.de/db/journals/pieee/pieee94.html#ChristiansenSG06}, volume = 94, year = 2006 }