%0 Journal Article %1 journals/tcad/ChenXY19 %A Chen, Song %A Xu, Qi %A Yu, Bei %D 2019 %J IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. %K dblp %N 5 %P 949-960 %T Adaptive 3D-IC TSV Fault Tolerance Structure Generation. %U http://dblp.uni-trier.de/db/journals/tcad/tcad38.html#ChenXY19 %V 38

@article{journals/tcad/ChenXY19, added-at = {2020-09-24T00:00:00.000+0200}, author = {Chen, Song and Xu, Qi and Yu, Bei}, biburl = {https://www.bibsonomy.org/bibtex/2fb3b98ddf14f861e2146d2335eb1d3db/dblp}, ee = {https://doi.org/10.1109/TCAD.2018.2824284}, interhash = {d6e32fdc15cccb349ba44ca2cf3eec58}, intrahash = {fb3b98ddf14f861e2146d2335eb1d3db}, journal = {IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.}, keywords = {dblp}, number = 5, pages = {949-960}, timestamp = {2020-09-25T11:46:22.000+0200}, title = {Adaptive 3D-IC TSV Fault Tolerance Structure Generation.}, url = {http://dblp.uni-trier.de/db/journals/tcad/tcad38.html#ChenXY19}, volume = 38, year = 2019 }