%0 Journal Article %1 journals/mr/BrinckerKSEP18 %A Brincker, Mads %A Kristensen, Peter Kjær %A Söhl, S. %A Eisele, R. %A Popok, Vladimir N. %D 2018 %J Microelectron. Reliab. %K dblp %P 774-778 %T Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects - A novel approach for hybrid metal baseplates. %U http://dblp.uni-trier.de/db/journals/mr/mr88.html#BrinckerKSEP18 %V 88-90

@article{journals/mr/BrinckerKSEP18, added-at = {2020-02-22T00:00:00.000+0100}, author = {Brincker, Mads and Kristensen, Peter Kjær and Söhl, S. and Eisele, R. and Popok, Vladimir N.}, biburl = {https://www.bibsonomy.org/bibtex/2f3ac76a28e1e4b3fe34acde1b3325737/dblp}, ee = {https://doi.org/10.1016/j.microrel.2018.06.051}, interhash = {d7e4f8e8ffb3f90beb2f720e4a6ddd66}, intrahash = {f3ac76a28e1e4b3fe34acde1b3325737}, journal = {Microelectron. Reliab.}, keywords = {dblp}, pages = {774-778}, timestamp = {2020-02-25T13:25:30.000+0100}, title = {Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects - A novel approach for hybrid metal baseplates.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr88.html#BrinckerKSEP18}, volume = {88-90}, year = 2018 }