%0 Journal Article %1 journals/mr/MarrasIMVS07 %A Marras, Alessandro %A Impronta, Maurizio %A Munari, Ilaria De %A Valentini, M. G. %A Scorzoni, Andrea %D 2007 %J Microelectron. Reliab. %K dblp %N 9-11 %P 1492-1496 %T Reliability assessment of multi-via Cu-damascene structures by wafer-level isothermal electromigration tests. %U http://dblp.uni-trier.de/db/journals/mr/mr47.html#MarrasIMVS07 %V 47

@article{journals/mr/MarrasIMVS07, added-at = {2020-02-22T00:00:00.000+0100}, author = {Marras, Alessandro and Impronta, Maurizio and Munari, Ilaria De and Valentini, M. G. and Scorzoni, Andrea}, biburl = {https://www.bibsonomy.org/bibtex/2b0ec521f8c40e2e5623b77d190f7535e/dblp}, ee = {https://doi.org/10.1016/j.microrel.2007.07.002}, interhash = {de2b062943b2e27df4f3b928d2ab706c}, intrahash = {b0ec521f8c40e2e5623b77d190f7535e}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = {9-11}, pages = {1492-1496}, timestamp = {2020-02-25T13:22:12.000+0100}, title = {Reliability assessment of multi-via Cu-damascene structures by wafer-level isothermal electromigration tests.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr47.html#MarrasIMVS07}, volume = 47, year = 2007 }