Inproceedings,
Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration.
T. Fukushima, Y. Ito, M. Murugesan, J. Bea, K. Lee, K. Choki, T. Tanaka, and M. Koyanagi.3DIC, page 1-4. IEEE, (2014)
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- conf/3dic/FukushimaIMBLCT14
- entry type
- inproceedings
- booktitle
- 3DIC
- year
- 2014
- pages
- 1-4
- publisher
- IEEE
- crossref
- conf/3dic/2014
- ee
- https://doi.org/10.1109/3DIC.2014.7152145
- isbn
- 978-1-4799-8472-5
- url
- http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#FukushimaIMBLCT14
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%1 conf/3dic/FukushimaIMBLCT14
%A Fukushima, Takafumi
%A Ito, Yuka
%A Murugesan, Mariappan
%A Bea, Jicheol
%A Lee, Kang Wook
%A Choki, Koji
%A Tanaka, Tetsu
%A Koyanagi, Mitsumasa
%B 3DIC
%D 2014
%I IEEE
%K dblp
%P 1-4
%T Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#FukushimaIMBLCT14
%@ 978-1-4799-8472-5
@inproceedings{conf/3dic/FukushimaIMBLCT14,
added-at = {2021-02-16T00:00:00.000+0100},
author = {Fukushima, Takafumi and Ito, Yuka and Murugesan, Mariappan and Bea, Jicheol and Lee, Kang Wook and Choki, Koji and Tanaka, Tetsu and Koyanagi, Mitsumasa},
biburl = {https://www.bibsonomy.org/bibtex/24641706c15c5ce03ab766eea0f4938f3/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2014},
ee = {https://doi.org/10.1109/3DIC.2014.7152145},
interhash = {e270b8e6b8d78fd7a9e85bca350c98bb},
intrahash = {4641706c15c5ce03ab766eea0f4938f3},
isbn = {978-1-4799-8472-5},
keywords = {dblp},
pages = {1-4},
publisher = {IEEE},
timestamp = {2024-04-10T12:10:53.000+0200},
title = {Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#FukushimaIMBLCT14},
year = 2014
}