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%0 Journal Article
%1 journals/tvlsi/KhanAH11
%A Khan, Nauman H.
%A Alam, Syed M.
%A Hassoun, Soha
%D 2011
%J IEEE Trans. Very Large Scale Integr. Syst.
%K dblp
%N 4
%P 647-658
%T Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies.
%U http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi19.html#KhanAH11
%V 19
@article{journals/tvlsi/KhanAH11,
added-at = {2020-03-11T00:00:00.000+0100},
author = {Khan, Nauman H. and Alam, Syed M. and Hassoun, Soha},
biburl = {https://www.bibsonomy.org/bibtex/210da668c5f1ee16ace36a1e733b257ed/dblp},
ee = {https://doi.org/10.1109/TVLSI.2009.2038165},
interhash = {e4937ff19e43f5f11425a0f0bf612483},
intrahash = {10da668c5f1ee16ace36a1e733b257ed},
journal = {IEEE Trans. Very Large Scale Integr. Syst.},
keywords = {dblp},
number = 4,
pages = {647-658},
timestamp = {2020-03-12T11:41:03.000+0100},
title = {Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies.},
url = {http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi19.html#KhanAH11},
volume = 19,
year = 2011
}
