%0 Conference Paper %1 conf/3dic/ZhangLA13 %A Zhang, Bei %A Li, Baohu %A Agrawal, Vishwani D. %B 3DIC %D 2013 %I IEEE %K dblp %P 1-8 %T Yield analysis of a novel wafer manipulation method in 3D stacking. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#ZhangLA13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/ZhangLA13, added-at = {2017-05-21T00:00:00.000+0200}, author = {Zhang, Bei and Li, Baohu and Agrawal, Vishwani D.}, biburl = {https://www.bibsonomy.org/bibtex/20c32f8690d1e699ef8c196cb1e6f48ff/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702370}, interhash = {e87f371f1f4b2572b4b9607f36a31ab3}, intrahash = {0c32f8690d1e699ef8c196cb1e6f48ff}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-8}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:37.000+0200}, title = {Yield analysis of a novel wafer manipulation method in 3D stacking.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#ZhangLA13}, year = 2013 }