%0 Journal Article %1 journals/mr/AliSSSJM18 %A Ali, Bakhtiar %A Sabri, Mohd Faizul Mohd %A Said, Suhana Binti Mohd %A Sukiman, Nazatul Liana %A Jauhari, Iswadi %A Mahdavifard, Mohammad Hossein %D 2018 %J Microelectron. Reliab. %K dblp %P 171-178 %T Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment. %U http://dblp.uni-trier.de/db/journals/mr/mr82.html#AliSSSJM18 %V 82

@article{journals/mr/AliSSSJM18, added-at = {2023-09-30T00:00:00.000+0200}, author = {Ali, Bakhtiar and Sabri, Mohd Faizul Mohd and Said, Suhana Binti Mohd and Sukiman, Nazatul Liana and Jauhari, Iswadi and Mahdavifard, Mohammad Hossein}, biburl = {https://www.bibsonomy.org/bibtex/23d1fc8b1ab5a3848adc58334ba32ae66/dblp}, ee = {https://doi.org/10.1016/j.microrel.2018.01.015}, interhash = {f7b28b565a2c29ea74901d03604b9ad4}, intrahash = {3d1fc8b1ab5a3848adc58334ba32ae66}, journal = {Microelectron. Reliab.}, keywords = {dblp}, pages = {171-178}, timestamp = {2024-04-09T02:50:29.000+0200}, title = {Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr82.html#AliSSSJM18}, volume = 82, year = 2018 }