%0 Journal Article %1 journals/mr/LaurilaMVKLSK07 %A Laurila, Tomi %A Mattila, Toni T. %A Vuorinen, Vesa %A Karppinen, Juha %A Li, Jue %A Sippola, Mika %A Kivilahti, Jorma K. %D 2007 %J Microelectron. Reliab. %K dblp %N 7 %P 1135-1144 %T Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests. %U http://dblp.uni-trier.de/db/journals/mr/mr47.html#LaurilaMVKLSK07 %V 47

@article{journals/mr/LaurilaMVKLSK07, added-at = {2022-03-03T00:00:00.000+0100}, author = {Laurila, Tomi and Mattila, Toni T. and Vuorinen, Vesa and Karppinen, Juha and Li, Jue and Sippola, Mika and Kivilahti, Jorma K.}, biburl = {https://www.bibsonomy.org/bibtex/28a44519b57e2bac173630b9569cbf552/dblp}, ee = {https://doi.org/10.1016/j.microrel.2006.07.095}, interhash = {f8ad93c5cbcf82d60e01080dcd25cd9c}, intrahash = {8a44519b57e2bac173630b9569cbf552}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 7, pages = {1135-1144}, timestamp = {2024-04-09T02:49:20.000+0200}, title = {Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr47.html#LaurilaMVKLSK07}, volume = 47, year = 2007 }