%0 Journal Article %1 journals/todaes/DasCK10 %A Das, Dipankar %A Chakrabarti, P. P. %A Kumar, Rajeev %D 2010 %J ACM Trans. Design Autom. Electr. Syst. %K dblp %N 2 %P 15:1-15:52 %T Thermal analysis of multiprocessor SoC applications by simulation and verification. %U http://dblp.uni-trier.de/db/journals/todaes/todaes15.html#DasCK10 %V 15

@article{journals/todaes/DasCK10, added-at = {2022-11-07T00:00:00.000+0100}, author = {Das, Dipankar and Chakrabarti, P. P. and Kumar, Rajeev}, biburl = {https://www.bibsonomy.org/bibtex/2833eb1e7f70de1f6715a0ca24b7bcae0/dblp}, ee = {https://doi.org/10.1145/1698759.1698765}, interhash = {fe12159b1dff1dc99973ade434c74c29}, intrahash = {833eb1e7f70de1f6715a0ca24b7bcae0}, journal = {ACM Trans. Design Autom. Electr. Syst.}, keywords = {dblp}, number = 2, pages = {15:1-15:52}, timestamp = {2024-04-08T21:43:11.000+0200}, title = {Thermal analysis of multiprocessor SoC applications by simulation and verification.}, url = {http://dblp.uni-trier.de/db/journals/todaes/todaes15.html#DasCK10}, volume = 15, year = 2010 }