%0 Journal Article %1 doi:10.1002/adma.202003252 %A Saggau, Christian N. %A Gabler, Felix %A Karnaushenko, Dmitriy D. %A Karnaushenko, Daniil %A Ma, Libo %A Schmidt, Oliver G. %D 2020 %J Adv. Mater. %K c d finalize %N 37 %P 2003252 %R 10.1002/adma.202003252 %T Wafer-scale high-quality microtubular devices fabricated via dry-etching for optical and microelectronic applications %U https://onlinelibrary.wiley.com/doi/abs/10.1002/adma.202003252 %V 32 %X Abstract Mechanical strain formed at the interfaces of thin films has been widely applied to self-assemble 3D microarchitectures. Among them, rolled-up microtubes possess a unique 3D geometry beneficial for working as photonic, electromagnetic, energy storage, and sensing devices. However, the yield and quality of microtubular architectures are often limited by the wet-release of lithographically patterned stacks of thin-film structures. To address the drawbacks of conventionally used wet-etching methods in self-assembly techniques, here a dry-release approach is developed to roll-up both metallic and dielectric, as well as metallic/dielectric hybrid thin films for the fabrication of electronic and optical devices. A silicon thin film sacrificial layer on insulator is etched by dry fluorine chemistry, triggering self-assembly of prestrained nanomembranes in a well-controlled wafer scale fashion. More than 6000 integrated microcapacitors as well as hundreds of active microtubular optical cavities are obtained in a simultaneous self-assembly process. The fabrication of wafer-scale self-assembled microdevices results in high yield, reproducibility, uniformity, and performance, which promise broad applications in microelectronics, photonics, and opto-electronics.

@article{doi:10.1002/adma.202003252, abstract = {Abstract Mechanical strain formed at the interfaces of thin films has been widely applied to self-assemble 3D microarchitectures. Among them, rolled-up microtubes possess a unique 3D geometry beneficial for working as photonic, electromagnetic, energy storage, and sensing devices. However, the yield and quality of microtubular architectures are often limited by the wet-release of lithographically patterned stacks of thin-film structures. To address the drawbacks of conventionally used wet-etching methods in self-assembly techniques, here a dry-release approach is developed to roll-up both metallic and dielectric, as well as metallic/dielectric hybrid thin films for the fabrication of electronic and optical devices. A silicon thin film sacrificial layer on insulator is etched by dry fluorine chemistry, triggering self-assembly of prestrained nanomembranes in a well-controlled wafer scale fashion. More than 6000 integrated microcapacitors as well as hundreds of active microtubular optical cavities are obtained in a simultaneous self-assembly process. The fabrication of wafer-scale self-assembled microdevices results in high yield, reproducibility, uniformity, and performance, which promise broad applications in microelectronics, photonics, and opto-electronics.}, added-at = {2020-08-20T11:24:44.000+0200}, author = {Saggau, Christian N. and Gabler, Felix and Karnaushenko, Dmitriy D. and Karnaushenko, Daniil and Ma, Libo and Schmidt, Oliver G.}, biburl = {https://www.bibsonomy.org/bibtex/27925306ff8ee786ab6d1c42860bc3b8e/ctqmat}, day = 19, doi = {10.1002/adma.202003252}, eprint = {https://onlinelibrary.wiley.com/doi/pdf/10.1002/adma.202003252}, interhash = {0334fa778052fad9dbaf3d30c80b8b1c}, intrahash = {7925306ff8ee786ab6d1c42860bc3b8e}, journal = {Adv. Mater. }, keywords = {c d finalize}, month = {7}, number = 37, pages = 2003252, timestamp = {2023-10-13T12:55:32.000+0200}, title = {Wafer-scale high-quality microtubular devices fabricated via dry-etching for optical and microelectronic applications}, url = {https://onlinelibrary.wiley.com/doi/abs/10.1002/adma.202003252}, volume = 32, year = 2020 }