%0 Conference Paper %1 conf/3dic/EnquistFPHG09 %A Enquist, Paul %A Fountain, G. %A Petteway, C. %A Hollingsworth, A. %A Grady, H. %B 3DIC %D 2009 %I IEEE %K dblp %P 1-6 %T Low Cost of Ownership scalable copper Direct Bond Interconnect 3D IC technology for three dimensional integrated circuit applications. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#EnquistFPHG09 %@ 978-1-4244-4512-7

@inproceedings{conf/3dic/EnquistFPHG09, added-at = {2017-05-21T00:00:00.000+0200}, author = {Enquist, Paul and Fountain, G. and Petteway, C. and Hollingsworth, A. and Grady, H.}, biburl = {https://www.bibsonomy.org/bibtex/2337062a147d85cef98d5e7f261166be7/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2009}, ee = {https://doi.org/10.1109/3DIC.2009.5306533}, interhash = {35de382b9d4f999d57912ce30f7daafe}, intrahash = {337062a147d85cef98d5e7f261166be7}, isbn = {978-1-4244-4512-7}, keywords = {dblp}, pages = {1-6}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:22.000+0200}, title = {Low Cost of Ownership scalable copper Direct Bond Interconnect 3D IC technology for three dimensional integrated circuit applications.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#EnquistFPHG09}, year = 2009 }