Abstract Mechanical strain formed at the interfaces of thin films has been widely applied to self-assemble 3D microarchitectures. Among them, rolled-up microtubes possess a unique 3D geometry beneficial for working as photonic, electromagnetic, energy storage, and sensing devices. However, the yield and quality of microtubular architectures are often limited by the wet-release of lithographically patterned stacks of thin-film structures. To address the drawbacks of conventionally used wet-etching methods in self-assembly techniques, here a dry-release approach is developed to roll-up both metallic and dielectric, as well as metallic/dielectric hybrid thin films for the fabrication of electronic and optical devices. A silicon thin film sacrificial layer on insulator is etched by dry fluorine chemistry, triggering self-assembly of prestrained nanomembranes in a well-controlled wafer scale fashion. More than 6000 integrated microcapacitors as well as hundreds of active microtubular optical cavities are obtained in a simultaneous self-assembly process. The fabrication of wafer-scale self-assembled microdevices results in high yield, reproducibility, uniformity, and performance, which promise broad applications in microelectronics, photonics, and opto-electronics.
%0 Journal Article
%1 doi:10.1002/adma.202003252
%A Saggau, Christian N.
%A Gabler, Felix
%A Karnaushenko, Dmitriy D.
%A Karnaushenko, Daniil
%A Ma, Libo
%A Schmidt, Oliver G.
%D 2020
%J Adv. Mater.
%K c d finalize
%N 37
%P 2003252
%R 10.1002/adma.202003252
%T Wafer-scale high-quality microtubular devices fabricated via dry-etching for optical and microelectronic applications
%U https://onlinelibrary.wiley.com/doi/abs/10.1002/adma.202003252
%V 32
%X Abstract Mechanical strain formed at the interfaces of thin films has been widely applied to self-assemble 3D microarchitectures. Among them, rolled-up microtubes possess a unique 3D geometry beneficial for working as photonic, electromagnetic, energy storage, and sensing devices. However, the yield and quality of microtubular architectures are often limited by the wet-release of lithographically patterned stacks of thin-film structures. To address the drawbacks of conventionally used wet-etching methods in self-assembly techniques, here a dry-release approach is developed to roll-up both metallic and dielectric, as well as metallic/dielectric hybrid thin films for the fabrication of electronic and optical devices. A silicon thin film sacrificial layer on insulator is etched by dry fluorine chemistry, triggering self-assembly of prestrained nanomembranes in a well-controlled wafer scale fashion. More than 6000 integrated microcapacitors as well as hundreds of active microtubular optical cavities are obtained in a simultaneous self-assembly process. The fabrication of wafer-scale self-assembled microdevices results in high yield, reproducibility, uniformity, and performance, which promise broad applications in microelectronics, photonics, and opto-electronics.
@article{doi:10.1002/adma.202003252,
abstract = {Abstract Mechanical strain formed at the interfaces of thin films has been widely applied to self-assemble 3D microarchitectures. Among them, rolled-up microtubes possess a unique 3D geometry beneficial for working as photonic, electromagnetic, energy storage, and sensing devices. However, the yield and quality of microtubular architectures are often limited by the wet-release of lithographically patterned stacks of thin-film structures. To address the drawbacks of conventionally used wet-etching methods in self-assembly techniques, here a dry-release approach is developed to roll-up both metallic and dielectric, as well as metallic/dielectric hybrid thin films for the fabrication of electronic and optical devices. A silicon thin film sacrificial layer on insulator is etched by dry fluorine chemistry, triggering self-assembly of prestrained nanomembranes in a well-controlled wafer scale fashion. More than 6000 integrated microcapacitors as well as hundreds of active microtubular optical cavities are obtained in a simultaneous self-assembly process. The fabrication of wafer-scale self-assembled microdevices results in high yield, reproducibility, uniformity, and performance, which promise broad applications in microelectronics, photonics, and opto-electronics.},
added-at = {2020-08-20T11:24:44.000+0200},
author = {Saggau, Christian N. and Gabler, Felix and Karnaushenko, Dmitriy D. and Karnaushenko, Daniil and Ma, Libo and Schmidt, Oliver G.},
biburl = {https://www.bibsonomy.org/bibtex/27925306ff8ee786ab6d1c42860bc3b8e/ctqmat},
day = 19,
doi = {10.1002/adma.202003252},
eprint = {https://onlinelibrary.wiley.com/doi/pdf/10.1002/adma.202003252},
interhash = {0334fa778052fad9dbaf3d30c80b8b1c},
intrahash = {7925306ff8ee786ab6d1c42860bc3b8e},
journal = {Adv. Mater. },
keywords = {c d finalize},
month = {7},
number = 37,
pages = 2003252,
timestamp = {2023-10-13T12:55:32.000+0200},
title = {Wafer-scale high-quality microtubular devices fabricated via dry-etching for optical and microelectronic applications},
url = {https://onlinelibrary.wiley.com/doi/abs/10.1002/adma.202003252},
volume = 32,
year = 2020
}