%0 Journal Article %1 journals/mr/WuXWW17 %A Wu, Jie %A Xue, Songbai %A Wang, Jingwen %A Wang, Jianxin %D 2017 %J Microelectron. Reliab. %K %P 124-135 %T Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments. %U http://dblp.uni-trier.de/db/journals/mr/mr79.html#WuXWW17 %V 79

@article{journals/mr/WuXWW17, added-at = {2023-12-12T20:40:20.000+0100}, author = {Wu, Jie and Xue, Songbai and Wang, Jingwen and Wang, Jianxin}, biburl = {https://www.bibsonomy.org/bibtex/2222d8ee63539b1477d07c43283a9969a/admin}, ee = {https://doi.org/10.1016/j.microrel.2017.10.020}, interhash = {329fc5f5ec7e9b4fa1bf6f8cdf41b8cd}, intrahash = {222d8ee63539b1477d07c43283a9969a}, journal = {Microelectron. Reliab.}, keywords = {}, pages = {124-135}, timestamp = {2023-12-12T20:40:20.000+0100}, title = {Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr79.html#WuXWW17}, volume = 79, year = 2017 }