%0 Journal Article %1 journals/mr/YimLLSK14 %A seung Yim, Byung %A Lee, Jeong-Il %A Lee, Byung-Hun %A Shin, Young-Eui %A Kim, Jong-Min %D 2014 %J Microelectron. Reliab. %K dblp %N 12 %P 2944-2950 %T An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler. %U http://dblp.uni-trier.de/db/journals/mr/mr54.html#YimLLSK14 %V 54

@article{journals/mr/YimLLSK14, added-at = {2020-02-22T00:00:00.000+0100}, author = {seung Yim, Byung and Lee, Jeong-Il and Lee, Byung-Hun and Shin, Young-Eui and Kim, Jong-Min}, biburl = {https://www.bibsonomy.org/bibtex/21f78b3aeac286cc3cdd977aeb3594589/dblp}, ee = {https://doi.org/10.1016/j.microrel.2014.07.143}, interhash = {3b22fe769dc83a00050e085062b32b4f}, intrahash = {1f78b3aeac286cc3cdd977aeb3594589}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 12, pages = {2944-2950}, timestamp = {2020-02-25T13:22:48.000+0100}, title = {An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr54.html#YimLLSK14}, volume = 54, year = 2014 }