%0 Conference Paper %1 conf/3dic/MiTUN11 %A Mi, Xiaoyu %A Toyoda, Osamu %A Ueda, Satoshi %A Nakazawa, Fumihiko %B 3DIC %D 2011 %E Koyanagi, Mitsumasa %E Kada, Morihiro %I IEEE %K dblp %P 1-5 %T A 3D heterogeneous integration method using LTCC wafer for RF applications. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#MiTUN11 %@ 978-1-4673-2189-1

@inproceedings{conf/3dic/MiTUN11, added-at = {2017-05-21T00:00:00.000+0200}, author = {Mi, Xiaoyu and Toyoda, Osamu and Ueda, Satoshi and Nakazawa, Fumihiko}, biburl = {https://www.bibsonomy.org/bibtex/2423a5a1c38e493b38dbe5dd6c065ebbd/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2011}, editor = {Koyanagi, Mitsumasa and Kada, Morihiro}, ee = {https://doi.org/10.1109/3DIC.2012.6262955}, interhash = {3e2c81e23d6932d716bb092d5b836d3c}, intrahash = {423a5a1c38e493b38dbe5dd6c065ebbd}, isbn = {978-1-4673-2189-1}, keywords = {dblp}, pages = {1-5}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:14.000+0200}, title = {A 3D heterogeneous integration method using LTCC wafer for RF applications.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#MiTUN11}, year = 2011 }