%0 Journal Article %1 journals/mr/ShnawahSB12 %A Shnawah, Dhafer Abdulameer %A Sabri, Mohd Faizul Mohd %A Badruddin, Irfan Anjum %D 2012 %J Microelectron. Reliab. %K dblp %N 1 %P 90-99 %T A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products. %U http://dblp.uni-trier.de/db/journals/mr/mr52.html#ShnawahSB12 %V 52

@article{journals/mr/ShnawahSB12, added-at = {2020-02-22T00:00:00.000+0100}, author = {Shnawah, Dhafer Abdulameer and Sabri, Mohd Faizul Mohd and Badruddin, Irfan Anjum}, biburl = {https://www.bibsonomy.org/bibtex/2fcd4aeb135779ce91b57add4ce8ec491/dblp}, ee = {https://doi.org/10.1016/j.microrel.2011.07.093}, interhash = {5e3f3b22f186f9bfb930df6fa81796de}, intrahash = {fcd4aeb135779ce91b57add4ce8ec491}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 1, pages = {90-99}, timestamp = {2020-02-25T13:30:02.000+0100}, title = {A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr52.html#ShnawahSB12}, volume = 52, year = 2012 }