%0 Conference Paper %1 conf/3dic/KoharaONTM15 %A Kohara, Sayuri %A Okamoto, Keishi %A Noma, Hirokazu %A Toriyama, Kazushige %A Mori, Hiroyuki %B 3DIC %D 2015 %I IEEE %K dblp %P TS8.17.1-TS8.17.5 %T Warpage analysis of organic substrates for 2.1D packaging. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#KoharaONTM15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/KoharaONTM15, added-at = {2022-10-02T00:00:00.000+0200}, author = {Kohara, Sayuri and Okamoto, Keishi and Noma, Hirokazu and Toriyama, Kazushige and Mori, Hiroyuki}, biburl = {https://www.bibsonomy.org/bibtex/2cd4147b5c12c0426dfbc768faa0f53e7/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334586}, interhash = {6744e585a0ffef77785bd867d5b06b22}, intrahash = {cd4147b5c12c0426dfbc768faa0f53e7}, isbn = {978-1-4673-9385-0}, keywords = {dblp}, pages = {TS8.17.1-TS8.17.5}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:59.000+0200}, title = {Warpage analysis of organic substrates for 2.1D packaging.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#KoharaONTM15}, year = 2015 }