%0 Journal Article %1 journals/mr/ChenCYK13 %A Chen, Y. J. %A Chung, C. K. %A Yang, C. R. %A Kao, C. Robert %D 2013 %J Microelectron. Reliab. %K dblp %N 1 %P 47-52 %T Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics. %U http://dblp.uni-trier.de/db/journals/mr/mr53.html#ChenCYK13 %V 53

@article{journals/mr/ChenCYK13, added-at = {2020-02-22T00:00:00.000+0100}, author = {Chen, Y. J. and Chung, C. K. and Yang, C. R. and Kao, C. Robert}, biburl = {https://www.bibsonomy.org/bibtex/2a83772da52ecf33f923f22a8459f7413/dblp}, ee = {https://doi.org/10.1016/j.microrel.2012.06.116}, interhash = {69086ec30bce38cf1d3db6c83bbc9131}, intrahash = {a83772da52ecf33f923f22a8459f7413}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 1, pages = {47-52}, timestamp = {2020-02-25T13:27:10.000+0100}, title = {Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr53.html#ChenCYK13}, volume = 53, year = 2013 }