Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective.
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%0 Journal Article
%1 journals/mr/RajaguruLBGA17
%A Rajaguru, Pushparajah
%A Lu, Hua
%A Bailey, Chris
%A Gonzalez, Jose Angel Ortiz
%A Alatise, Olayiwola
%D 2017
%J Microelectron. Reliab.
%K dblp
%P 77-85
%T Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective.
%U http://dblp.uni-trier.de/db/journals/mr/mr68.html#RajaguruLBGA17
%V 68
@article{journals/mr/RajaguruLBGA17,
added-at = {2021-10-14T00:00:00.000+0200},
author = {Rajaguru, Pushparajah and Lu, Hua and Bailey, Chris and Gonzalez, Jose Angel Ortiz and Alatise, Olayiwola},
biburl = {https://www.bibsonomy.org/bibtex/2cd9504614a8e43454b0bfa13843751db/dblp},
ee = {https://doi.org/10.1016/j.microrel.2016.12.002},
interhash = {6ad92a05c31e7398c84ca5b35f0201c7},
intrahash = {cd9504614a8e43454b0bfa13843751db},
journal = {Microelectron. Reliab.},
keywords = {dblp},
pages = {77-85},
timestamp = {2024-04-09T02:50:44.000+0200},
title = {Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr68.html#RajaguruLBGA17},
volume = 68,
year = 2017
}
