Abstract
In this paper we consider an approach to optimization manufacturing elements of emitter-coupled logic. The optimization gives us possibility to decrease dimensions of these elements. The technological part based on manufacture a heterostructure with required configuration, doping by diffusion or ion implantation of required areas of heterostructure and optimization of annealing of dopant and/or radiation defects. The modelling part based on modified method of functional corrections, which using without crosslinking of solutions on interfaces between layers of heterostructure.
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