%0 Journal Article %1 journals/mr/FeilHGN17 %A Feil, D. %A Herberholz, T. %A Guyenot, M. %A Nowottnick, Mathias %D 2017 %J Microelectron. Reliab. %K dblp %P 455-459 %T Highly variable Sn-Cu diffusion soldering process for high performance power electronics. %U http://dblp.uni-trier.de/db/journals/mr/mr76.html#FeilHGN17 %V 76-77

@article{journals/mr/FeilHGN17, added-at = {2020-02-22T00:00:00.000+0100}, author = {Feil, D. and Herberholz, T. and Guyenot, M. and Nowottnick, Mathias}, biburl = {https://www.bibsonomy.org/bibtex/2afba2c37a30f7432fe48ea50dcc37558/dblp}, ee = {https://doi.org/10.1016/j.microrel.2017.07.058}, interhash = {7fb29215dbb81b80d103a78bafdacd94}, intrahash = {afba2c37a30f7432fe48ea50dcc37558}, journal = {Microelectron. Reliab.}, keywords = {dblp}, pages = {455-459}, timestamp = {2020-02-25T13:23:32.000+0100}, title = {Highly variable Sn-Cu diffusion soldering process for high performance power electronics.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr76.html#FeilHGN17}, volume = {76-77}, year = 2017 }