%0 Conference Paper %1 conf/3dic/PanigrahiBGVS15 %A Panigrahi, Asisa Kumar %A Bonam, Satish %A Ghosh, Tamal %A Vanjari, Siva Rama Krishna %A Singh, Shiv Govind %B 3DIC %D 2015 %I IEEE %K dblp %P TS8.13.1-TS8.13.5 %T Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#PanigrahiBGVS15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/PanigrahiBGVS15, added-at = {2019-10-19T00:00:00.000+0200}, author = {Panigrahi, Asisa Kumar and Bonam, Satish and Ghosh, Tamal and Vanjari, Siva Rama Krishna and Singh, Shiv Govind}, biburl = {https://www.bibsonomy.org/bibtex/26798ef9884f417eec51c5a2ac5a8787e/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334582}, interhash = {91bf814d0743421310601b5efc95ce8d}, intrahash = {6798ef9884f417eec51c5a2ac5a8787e}, isbn = {978-1-4673-9385-0}, keywords = {dblp}, pages = {TS8.13.1-TS8.13.5}, publisher = {IEEE}, timestamp = {2019-10-22T16:17:18.000+0200}, title = {Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#PanigrahiBGVS15}, year = 2015 }