%0 Conference Paper %1 conf/3dic/CivaleTPJADSTB09 %A Civale, Yann %A Tezcan, Deniz Sabuncuoglu %A Philipsen, Harold G. G. %A Jaenen, P. %A Agarwal, Rahul %A Duval, F. %A Soussan, Philippe %A Travaly, Youssef %A Beyne, Eric %B 3DIC %D 2009 %I IEEE %K dblp %P 1-4 %T Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#CivaleTPJADSTB09 %@ 978-1-4244-4512-7

@inproceedings{conf/3dic/CivaleTPJADSTB09, added-at = {2021-10-14T00:00:00.000+0200}, author = {Civale, Yann and Tezcan, Deniz Sabuncuoglu and Philipsen, Harold G. G. and Jaenen, P. and Agarwal, Rahul and Duval, F. and Soussan, Philippe and Travaly, Youssef and Beyne, Eric}, biburl = {https://www.bibsonomy.org/bibtex/23136e02d7c4c4b507141114a8d07b1d1/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2009}, ee = {https://doi.org/10.1109/3DIC.2009.5306559}, interhash = {a0a57fc593f56d70e8ee96ece4ddd751}, intrahash = {3136e02d7c4c4b507141114a8d07b1d1}, isbn = {978-1-4244-4512-7}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:49.000+0200}, title = {Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#CivaleTPJADSTB09}, year = 2009 }