%0 Journal Article %1 journals/pieee/ColomboPP09 %A Colombo, Luigi Pietro Maria %A Paleari, Davide %A Petrushin, Alexey %D 2009 %J Proc. IEEE %K dblp %N 1 %P 70-77 %T A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in Thermal Modeling of SiPs and Stacked Die Packages. %U http://dblp.uni-trier.de/db/journals/pieee/pieee97.html#ColomboPP09 %V 97

@article{journals/pieee/ColomboPP09, added-at = {2020-10-02T00:00:00.000+0200}, author = {Colombo, Luigi Pietro Maria and Paleari, Davide and Petrushin, Alexey}, biburl = {https://www.bibsonomy.org/bibtex/21636aaf96b8965792d9d16fb3399dc59/dblp}, ee = {https://www.wikidata.org/entity/Q57741622}, interhash = {b3b5f03c1ea43c44272f6c75824d28ae}, intrahash = {1636aaf96b8965792d9d16fb3399dc59}, journal = {Proc. IEEE}, keywords = {dblp}, number = 1, pages = {70-77}, timestamp = {2020-10-03T11:43:41.000+0200}, title = {A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in Thermal Modeling of SiPs and Stacked Die Packages.}, url = {http://dblp.uni-trier.de/db/journals/pieee/pieee97.html#ColomboPP09}, volume = 97, year = 2009 }