%0 Journal Article %1 journals/mr/ChuLPS17 %A Chu, Kunmo %A Lee, Changseung %A Park, Sung-Hoon %A Sohn, Yoonchul %D 2017 %J Microelectron. Reliab. %K dblp %P 53-58 %T Effects of Ag addition and Ag3Sn formation on the mechanical reliability of Ni/Sn solder joints. %U http://dblp.uni-trier.de/db/journals/mr/mr75.html#ChuLPS17 %V 75

@article{journals/mr/ChuLPS17, added-at = {2020-02-22T00:00:00.000+0100}, author = {Chu, Kunmo and Lee, Changseung and Park, Sung-Hoon and Sohn, Yoonchul}, biburl = {https://www.bibsonomy.org/bibtex/20db48f6d0fb54b46603927b99d373071/dblp}, ee = {https://doi.org/10.1016/j.microrel.2017.06.012}, interhash = {e22ed519fbea9797cdf2a8068e9f6b5e}, intrahash = {0db48f6d0fb54b46603927b99d373071}, journal = {Microelectron. Reliab.}, keywords = {dblp}, pages = {53-58}, timestamp = {2020-02-25T13:25:08.000+0100}, title = {Effects of Ag addition and Ag3Sn formation on the mechanical reliability of Ni/Sn solder joints.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr75.html#ChuLPS17}, volume = 75, year = 2017 }