Inproceedings,
8Gb 3D DDR3 DRAM using through-silicon-via technology.
U. Kang, H. Chung, S. Heo, S. Ahn, H. Lee, S. Cha, J. Ahn, D. Kwon, J. Kim, J. Lee, H. Joo, W. Kim, H. Kim, E. Lee, S. Kim, K. Ma, D. Jang, N. Kim, M. Choi, S. Oh, J. Lee, T. Jung, J. Yoo, and C. Kim.ISSCC, page 130-131. IEEE, (2009)
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- conf/isscc/KangCHALCAKKLJKKLKMJKCOLJYK09
- entry type
- inproceedings
- booktitle
- ISSCC
- year
- 2009
- pages
- 130-131
- publisher
- IEEE
- crossref
- conf/isscc/2009
- ee
- http://dx.doi.org/10.1109/ISSCC.2009.4977342
- isbn
- 978-1-4244-3458-9
- url
- http://dblp.uni-trier.de/db/conf/isscc/isscc2009.html#KangCHALCAKKLJKKLKMJKCOLJYK09
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%1 conf/isscc/KangCHALCAKKLJKKLKMJKCOLJYK09
%A Kang, Uksong
%A Chung, Hoeju
%A Heo, Seongmoo
%A Ahn, Soon-Hong
%A Lee, Hoon
%A Cha, Sooho
%A Ahn, Jaesung
%A Kwon, Dukmin
%A Kim, Jin Ho
%A Lee, Jaewook
%A Joo, Han-Sung
%A Kim, Woo-Seop
%A Kim, Hyun-Kyung
%A Lee, Eun-Mi
%A Kim, So-Ra
%A Ma, Keum-Hee
%A Jang, Dong-Hyun
%A Kim, Nam-Seog
%A Choi, Man-Sik
%A Oh, Sae-Jang
%A Lee, Jung-Bae
%A Jung, Tae-Kyung
%A Yoo, Jei-Hwan
%A Kim, Changhyun
%B ISSCC
%D 2009
%I IEEE
%K
%P 130-131
%T 8Gb 3D DDR3 DRAM using through-silicon-via technology.
%U http://dblp.uni-trier.de/db/conf/isscc/isscc2009.html#KangCHALCAKKLJKKLKMJKCOLJYK09
%@ 978-1-4244-3458-9
@inproceedings{conf/isscc/KangCHALCAKKLJKKLKMJKCOLJYK09,
added-at = {2023-12-14T15:22:54.000+0100},
author = {Kang, Uksong and Chung, Hoeju and Heo, Seongmoo and Ahn, Soon-Hong and Lee, Hoon and Cha, Sooho and Ahn, Jaesung and Kwon, Dukmin and Kim, Jin Ho and Lee, Jaewook and Joo, Han-Sung and Kim, Woo-Seop and Kim, Hyun-Kyung and Lee, Eun-Mi and Kim, So-Ra and Ma, Keum-Hee and Jang, Dong-Hyun and Kim, Nam-Seog and Choi, Man-Sik and Oh, Sae-Jang and Lee, Jung-Bae and Jung, Tae-Kyung and Yoo, Jei-Hwan and Kim, Changhyun},
biburl = {https://www.bibsonomy.org/bibtex/2c39185c8cf4e3a46081224cc9a0e9c06/admin},
booktitle = {ISSCC},
crossref = {conf/isscc/2009},
ee = {http://dx.doi.org/10.1109/ISSCC.2009.4977342},
interhash = {ea6e858ded71a630fc733568e41eede9},
intrahash = {c39185c8cf4e3a46081224cc9a0e9c06},
isbn = {978-1-4244-3458-9},
keywords = {},
pages = {130-131},
publisher = {IEEE},
timestamp = {2023-12-14T15:22:54.000+0100},
title = {8Gb 3D DDR3 DRAM using through-silicon-via technology.},
url = {http://dblp.uni-trier.de/db/conf/isscc/isscc2009.html#KangCHALCAKKLJKKLKMJKCOLJYK09},
year = 2009
}