Article,

Fundamentals of Lead-Free Solder Interconnect Technology (from Microstructures to Reliability). Springer (2015). XIII pp. 253, ISBN: 978-1-4614-9265-8 (Print), 978-1-4614-9266-5 (Online).

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Microelectron. Reliab., 55 (5): 852 (2015)

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