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Multi-physics modeling in virtual prototyping of electronic packages--combined thermal, thermo-mechanical and vapor pressure modeling., , и . Microelectron. Reliab., 44 (12): 1967-1976 (2004)Reliability modelling for packages in flexible end-products., , , , , , и . Microelectron. Reliab., 46 (9-11): 1880-1885 (2006)Effects of single vacancy defect position on the stability of carbon nanotubes., , , и . Microelectron. Reliab., 52 (7): 1279-1284 (2012)A review on discoloration and high accelerated testing of optical materials in LED based-products., , , , и . Microelectron. Reliab., (2018)Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods., , , , , , и . Microelectron. Reliab., 44 (12): 2019-2027 (2004)Open Source Software Sustainability Models: Initial White Paper from the Information Technology for Cancer Research Sustainability and Industry Partnership Work Group., , , , , , , , , и 13 other автор(ы). CoRR, (2019)Correlation between chemistry of polymer building blocks and microelectronics reliability., , , , и . Microelectron. Reliab., 47 (2-3): 290-294 (2007)Multi-physics reliability simulation for solid state lighting drivers., , и . Microelectron. Reliab., 54 (6-7): 1212-1222 (2014)Comparing drop impact test method using strain gauge measurements., , , , , и . Microelectron. Reliab., 49 (9-11): 1299-1303 (2009)A Distributed Semantic Web Approach for Cohort Identification., , , , и . AMIA, AMIA, (2012)