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Intrinsic reliability of local interconnects for N7 and beyond.

K. Croes, A. Lesniewska, C. Wu, I. Ciofi, A. Banczerowska, B. Briggs, S. Demuynck, Z. Tökei, J. Bömmels, Y. Saad, и W. Gao. IRPS, стр. 2. IEEE, (2015)

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Jürgen Bömmels

Nicolaus Bömmels

Другие публикации лиц с тем же именем

Constant voltage electromigration for advanced BEOL copper interconnects.B. Tang, K. Croes, N. Jourdan, J. Bömmels, Z. Tökei, I. Wolf, E. Wilcox, и T. McMullen. IRPS, стр. 2. IEEE, (2015)Impact of process variability on BEOL TDDB lifetime model assessment.K. Croes, D. Kocaay, I. Ciofi, J. Bömmels, и Z. Tökei. IRPS, стр. 5. IEEE, (2015)Layout Considerations of Logic Designs Using an N-layer 3D Nanofabric Process Flow.E. Giacomin, J. Bömmels, J. Ryckaert, F. Catthoor, и P. Gaillardon. VLSI-SOC, стр. 34-39. IEEE, (2020)Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects.L. Kljucar, M. Gonzalez, K. Croes, I. Wolf, J. Messemaeker, G. Murdoch, P. Nolmans, J. Vos, J. Bömmels, E. Beyne и 1 other автор(ы). Microelectron. Reliab., (2017)Circuit and process co-design with vertical gate-all-around nanowire FET technology to extend CMOS scaling for 5nm and beyond technologies.T. Bao, D. Yakimets, J. Ryckaert, I. Ciofi, R. Baert, A. Veloso, J. Bömmels, N. Collaert, P. Roussel, S. Demuynck и 6 other автор(ы). ESSDERC, стр. 102-105. IEEE, (2014)Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation.H. Zahedmanesh, M. Gonzalez, I. Ciofi, K. Croes, J. Bömmels, и Z. Tökei. Microelectron. Reliab., (2016)3D Nanofabric: Layout Challenges and Solutions for Ultra-scaled Logic Designs.E. Giacomin, J. Bömmels, J. Ryckaert, F. Catthoor, и P. Gaillardon. VLSI-SoC (Selected Papers), том 621 из IFIP Advances in Information and Communication Technology, стр. 279-300. Springer, (2020)Intrinsic reliability of local interconnects for N7 and beyond.K. Croes, A. Lesniewska, C. Wu, I. Ciofi, A. Banczerowska, B. Briggs, S. Demuynck, Z. Tökei, J. Bömmels, Y. Saad и 1 other автор(ы). IRPS, стр. 2. IEEE, (2015)Design Technology co-optimization for N10.J. Ryckaert, P. Raghavan, R. Baert, M. Bardon, M. Dusa, A. Mallik, S. Sakhare, B. Vandewalle, P. Wambacq, B. Chava и 18 other автор(ы). CICC, стр. 1-8. IEEE, (2014)Integration of a Stacked Contact MOL for Monolithic CFET.V. Vega-Gonzalez, D. Radisic, B. Chan, S. Choudhury, S. Wang, A. Mingardi, Q. Le, H. Decoster, Y. Oniki, P. Puttarame и 13 other автор(ы). VLSI Technology and Circuits, стр. 1-2. IEEE, (2023)

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Jürgen Bömmels

Nicolaus Bömmels

Jürgen Schmidt

Jürgen Meyer

Jürgen Braun

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копироватьудалитьдобавить публикацию в буферЗапись сообществапосмотреть историю данной записиURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Intrinsic reliability of local interconnects for N7 and beyond.

Please choose a person to relate this publication to

Jürgen Bömmels

Nicolaus Bömmels

Jürgen Schmidt

Jürgen Meyer

Jürgen Braun

Другие публикации лиц с тем же именем

Disambiguation