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A Fast Leakage-Aware Full-Chip Transient Thermal Estimation Method., , , , , , , и . IEEE Trans. Computers, 67 (5): 617-630 (2018)Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires., , , , и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 37 (12): 3137-3150 (2018)EM-Based on-Chip Aging Sensor for Detection and Prevention of Counterfeit and Recycled ICs., , и . ICCAD, стр. 146-151. IEEE, (2015)From Robust Chip to Smart Building: CAD Algorithms and Methodologies for Uncertainty Analysis of Building Performance., , и . ICCAD, стр. 457-464. IEEE, (2015)HierPINN-EM: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnects Using Hierarchical Physics-Informed Neural Network., , , , и . ICCAD, стр. 28:1-28:9. ACM, (2022)EM-GAN: Fast Stress Analysis for Multi-Segment Interconnect Using Generative Adversarial Networks., , , и . CoRR, (2020)EM-Aware and Lifetime-Constrained Optimization for Multisegment Power Grid Networks., , , , и . IEEE Trans. Very Large Scale Integr. Syst., 27 (4): 940-953 (2019)An efficient statistical chip-level total power estimation method considering process variations with spatial correlation., , и . ISQED, стр. 671-676. IEEE, (2011)Compact nonlinear thermal modeling of packaged integrated systems., , , , и . ASP-DAC, стр. 157-162. IEEE, (2013)GPU-accelerated parallel Monte Carlo analysis of analog circuits by hierarchical graph-based solver., и . ASP-DAC, стр. 719-724. IEEE, (2015)