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Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study.

, , , , , , и . 3DIC, стр. TS8.10.1-TS8.10.5. IEEE, (2015)

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K W Schulte

Carsten K W Meininghaus

Christoph K W Deinzer

Matthias K W Bandorf

Xavier Lee Lee

 

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Optimising neural network weights using genetic algorithms: a case study., и . ICNN, стр. 1384-1388. IEEE, (1995)Roadmap constrained SLAM in neighborhood environment., , и . ICARCV, стр. 449-454. IEEE, (2004)A random finite set based detection and tracking using 3D LIDAR in dynamic environments., , , , и . SMC, стр. 2288-2292. IEEE, (2010)Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers., , , , , , , , и . 3DIC, стр. TS1.2.1-TS1.2.4. IEEE, (2015)FISST-SLAM: Finite Set Statistical Approach to Simultaneous Localization and Mapping., , и . Int. J. Robotics Res., 29 (10): 1251-1262 (2010)Transistor Reliability Characterization for Advanced DRAM with HK+MG & EUV process technology., , , , , , , , и . IRPS, стр. 6. IEEE, (2022)A Roadmap for Autostereoscopic Multi-Viewer Domestic TV Displays., , , , и . ICME, стр. 1693-1696. IEEE Computer Society, (2006)Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University., , , , и . 3DIC, стр. FS2.1-FS2.5. IEEE, (2015)Stochastic models for random-request availability.. IEEE Trans. Reliability, 49 (1): 80-84 (2000)TDX-1: A Distributed System Architecture for High Throughout Telephone Switching., , и . COMPCON, стр. 284-287. IEEE Computer Society, (1987)