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A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications., , , , , , , и . 3DIC, стр. 1-5. IEEE, (2011)A 0.18μm CMOS 802.15.4a UWB Transceiver for Communication and Localization., , , , , , , и . ISSCC, стр. 118-119. IEEE, (2008)Characterization of Silicon Mach-Zehnder Modulator in 20-Gbps NRZ-BPSK Transmission., , , , , , , , , и . IEICE Trans. Electron., 96-C (7): 974-980 (2013)Low-voltage silicon Mach-Zehnder modulator operating at high temperatures without thermo-electric cooling., , , , , , , , и . OFC, стр. 1-3. IEEE, (2016)Real-time spectral dynamics of femtosecond solitons under free-carrier nonlinearity in silicon photonic crystals., , , , , , , и . OFC, стр. 1-3. IEEE, (2015)Vertically scaled MOSFET gate stacks and junctions: How far are we likely to go?, , , , , , , , , и 5 other автор(ы). IBM J. Res. Dev., 46 (2-3): 299-316 (2002)20-Gb/s DPSK transmission with 550-ps/nm dispersion tolerance using silicon Mach-Zehnder modulator., , , , , , , , и . OFC/NFOEC, стр. 1-3. IEEE, (2013)Silicon Nanowires embedded pressure sensor with annularly grooved diaphragm for sensitivity improvement., , , , , и . ISSNIP, стр. 1-6. IEEE, (2014)128Gb/s DP-QPSK silicon modulator module integrated with driver amplifiers., , , , , , , и . ECOC, стр. 1-3. IEEE, (2014)Perspective of flash memory realized on vertical Si nanowires., , , , и . Microelectron. Reliab., 52 (4): 651-661 (2012)