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3DIC multi-project fabrication run being organized by CMC/CMP/MOSIS and Tezzaron.. 3DIC, стр. 1-10. IEEE, (2010)Investigation of Timing Properties for an Event Driven with Access and Reset Decoder Readout Architecture for a Pixel Array., , и . PRIME, стр. 113-116. IEEE, (2022)Pixellated readout IC: Analysis for single photon infrared detector for fast time of arrival applications., , , и . ISCAS, стр. 682-685. IEEE, (2015)Asynchronous Approximation of a Center of Gravity for Pixel Detectors' Readout Circuits., , и . IEEE J. Solid State Circuits, 53 (5): 1550-1558 (2018)A content addressable memory with multi-Vdd scheme for low power tunable operation., , , , , , , , и . MWSCAS, стр. 401-404. IEEE, (2017)An Algorithm of an X-ray Hit Allocation to a Single Pixel in a Cluster and Its Test-Circuit Implementation., , , , , , , , , и . IEEE Trans. Circuits Syst. I Regul. Pap., 65-I (1): 185-197 (2018)Peak Prediction Using Multi Layer Perceptron (MLP) for Edge Computing ASICs Targeting Scientific Applications., , , , , , , , , и 1 other автор(ы). ISQED, стр. 1-6. IEEE, (2022)Pixel detectors in 3D technologies for high energy physics., , , , , , и . 3DIC, стр. 1-4. IEEE, (2010)A 1.2-V 6-GHz Dual-Path Charge-Pump PLL Frequency Synthesizer for Quantum Control and Readout in CMOS 65-nm Process., , , и . UEMCON, стр. 570-576. IEEE, (2020)Ultra fast X-ray detection systems in nanometer and 3D technologies., , , , , , , , , и 2 other автор(ы). MIXDES, стр. 38-41. IEEE, (2014)