%0 Conference Paper %1 conf/cicc/RahmanTNT06 %A Rahman, Arifur %A Trezza, John %A New, Bernard J. %A Trimberger, Stephen %B CICC %D 2006 %I IEEE %K %P 587-590 %T Die Stacking Technology for Terabit Chip-to-Chip Communications. %U http://dblp.uni-trier.de/db/conf/cicc/cicc2006.html#RahmanTNT06 %@ 1-4244-0075-9

@inproceedings{conf/cicc/RahmanTNT06, added-at = {2023-12-12T17:43:38.000+0100}, author = {Rahman, Arifur and Trezza, John and New, Bernard J. and Trimberger, Stephen}, biburl = {https://www.bibsonomy.org/bibtex/22f5e9ce820b2640db43869d7e420eff5/admin}, booktitle = {CICC}, crossref = {conf/cicc/2006}, ee = {https://doi.org/10.1109/CICC.2006.320826}, interhash = {07d7e65f036d0ea7ea4604eddb40595e}, intrahash = {2f5e9ce820b2640db43869d7e420eff5}, isbn = {1-4244-0075-9}, keywords = {}, pages = {587-590}, publisher = {IEEE}, timestamp = {2023-12-12T17:43:38.000+0100}, title = {Die Stacking Technology for Terabit Chip-to-Chip Communications.}, url = {http://dblp.uni-trier.de/db/conf/cicc/cicc2006.html#RahmanTNT06}, year = 2006 }