%0 Conference Paper %1 conf/dac/OuTC15 %A Ou, Hung-Chih %A Tseng, Kai-Han %A Chang, Yao-Wen %B DAC %D 2015 %I ACM %K dblp %P 190:1-190:6 %T Cutting structure-aware analog placement based on self-aligned double patterning with e-beam lithography. %U http://dblp.uni-trier.de/db/conf/dac/dac2015.html#OuTC15 %@ 978-1-4503-3520-1

@inproceedings{conf/dac/OuTC15, added-at = {2018-11-06T00:00:00.000+0100}, author = {Ou, Hung-Chih and Tseng, Kai-Han and Chang, Yao-Wen}, biburl = {https://www.bibsonomy.org/bibtex/25051726b69cf9d8fe1a70ba8f0c334ba/dblp}, booktitle = {DAC}, crossref = {conf/dac/2015}, ee = {https://doi.org/10.1145/2744769.2744813}, interhash = {0a6182153951cb4d9da658755ea13acd}, intrahash = {5051726b69cf9d8fe1a70ba8f0c334ba}, isbn = {978-1-4503-3520-1}, keywords = {dblp}, pages = {190:1-190:6}, publisher = {ACM}, timestamp = {2018-11-07T15:14:15.000+0100}, title = {Cutting structure-aware analog placement based on self-aligned double patterning with e-beam lithography.}, url = {http://dblp.uni-trier.de/db/conf/dac/dac2015.html#OuTC15}, year = 2015 }