Meta data
- BibTeX key
- conf/3dic/JungCKKKKBC13
- entry type
- inproceedings
- booktitle
- 3DIC
- year
- 2013
- pages
- 1-4
- publisher
- IEEE
- crossref
- conf/3dic/2013
- ee
- https://doi.org/10.1109/3DIC.2013.6702376
- isbn
- 978-1-4673-6484-3
- url
- http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#JungCKKKKBC13
Tags
Users
Comments and Reviewsshow / hide
Cite this publication
More citation styles
- please select -%0 Conference Paper
%1 conf/3dic/JungCKKKKBC13
%A Jung, Daniel H.
%A Cho, Jonghyun
%A Kim, Heegon
%A Kim, Jonghoon J.
%A Kim, Hongseok
%A Kim, Joungho
%A Bae, Hyun-Cheol
%A Choi, Kwang-Seong
%B 3DIC
%D 2013
%I IEEE
%K dblp
%P 1-4
%T Fault isolation of short defect in through silicon via (TSV) based 3D-IC.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#JungCKKKKBC13
%@ 978-1-4673-6484-3
@inproceedings{conf/3dic/JungCKKKKBC13,
added-at = {2017-05-21T00:00:00.000+0200},
author = {Jung, Daniel H. and Cho, Jonghyun and Kim, Heegon and Kim, Jonghoon J. and Kim, Hongseok and Kim, Joungho and Bae, Hyun-Cheol and Choi, Kwang-Seong},
biburl = {https://www.bibsonomy.org/bibtex/244dc969e34b03d9acafde36d41f61dd2/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2013},
ee = {https://doi.org/10.1109/3DIC.2013.6702376},
interhash = {02d85f6238eb098a06eca704f44f385e},
intrahash = {44dc969e34b03d9acafde36d41f61dd2},
isbn = {978-1-4673-6484-3},
keywords = {dblp},
pages = {1-4},
publisher = {IEEE},
timestamp = {2019-10-17T15:31:37.000+0200},
title = {Fault isolation of short defect in through silicon via (TSV) based 3D-IC.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#JungCKKKKBC13},
year = 2013
}